Economic analysis of low cost silicon sheet produced from Czochralski grown materialThis study shows that the lower limits for manufacturing add-on costs to convert polysilicon to wafers is in the range of $22 to $26/sq m with the cost about equally divided between the crystal growth and wafering processes. However, the $22 to $26/sq m cost limit should be viewed as an asymptote since it is based on multicharge or continuous growth configurations, solidification rates in excess of 2 Kg/hr, multiblade wafering and a slice plus kerf of .045 cm. It should also be emphasized that the results of this study are based on as-sawn wafers, 100% yields (growth and slicing) and no profit. To the first approximation, the limiting cost factors are crucible material and furnace parts for growth and blade material and slurry for slicing.
Document ID
19780027127
Acquisition Source
Legacy CDMS
Document Type
Conference Proceedings
Authors
Koliwad, K. M. (Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Leipold, M. H. (Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Cumming, G. D. (Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Digges, T. G., Jr. (California Institute of Technology, Jet Propulsion Laboratory, Pasadena Calif., United States)