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High temperature composite bonding with PPQA polyphenylquinoxaline (PPQ) was evaluated as a high temperature adhesive for joining polyimide graphite laminates (PI/Gr) to PI/Gr, PI/Gr to titanium (Ti), and Ti to Ti. The effect of polymer molecular weight, processing parameters, 3-day water boil, and 316 C (600 F) aging in air upon lap shear strengths is presented. Titanium to Ti climbing drum peel and PI/Gr to polyimide glass honeycomb flatwise tensile strengths are also presented.
Document ID
19780032974
Acquisition Source
Legacy CDMS
Document Type
Conference Proceedings
Authors
Hergenrother, P. M. (NASA Langley Research Center Hampton, VA, United States)
Progar, D. J. (NASA Langley Research Center Hampton, Va., United States)
Date Acquired
August 9, 2013
Publication Date
January 1, 1977
Subject Category
Mechanical Engineering
Meeting Information
Meeting: National Symposium and Exhibition
Location: San Diego, CA
Start Date: April 26, 1977
End Date: April 28, 1977
Accession Number
78A16883
Funding Number(s)
CONTRACT_GRANT: NSG-1124
Distribution Limits
Public
Copyright
Other

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