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Ion beam sputter etching and deposition of fluoropolymersFluoropolymer etching and deposition techniques including thermal evaporation, RF sputtering, plasma polymerization, and ion beam sputtering are reviewed. Etching and deposition mechanisms and material characteristics are discussed. Ion beam sputter etch rates for polytetrafluoroethylene (PTFE) were determined as a function of ion energy, current density and ion beam power density. Peel strengths were measured for epoxy bonds to various ion beam sputtered fluoropolymers. Coefficients of static and dynamic friction were measured for fluoropolymers deposited from ion bombarded PTFE.
Document ID
19780053775
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Banks, B. A.
(NASA Lewis Research Center Cleveland, OH, United States)
Sovey, J. S.
(NASA Lewis Research Center Cleveland, OH, United States)
Miller, T. B.
(NASA Lewis Research Center Cleveland, OH, United States)
Crandall, K. S.
(NASA Lewis Research Center Cleveland, Ohio, United States)
Date Acquired
August 9, 2013
Publication Date
May 1, 1978
Subject Category
Nonmetallic Materials
Meeting Information
Meeting: International Conference on Electron and Ion Beam Science and Technology
Location: Seattle, WA
Start Date: May 21, 1978
End Date: May 26, 1978
Sponsors: Electrochemical Society
Accession Number
78A37684
Distribution Limits
Public
Copyright
Other

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