Effects of mechanical and thermal cycling on composite and hybrid laminates with residual stresses

The effects of tensile load cycling and thermal cycling on residual stiffness and strength properties of the following composite and hybrid angle-ply laminates were studied: boron/epoxy, boron/polyimide, graphite/low-modulus epoxy, graphite/high-modulus epoxy, graphite/polyimide, S-glass/epoxy, graphite/Kevlar 49/epoxy, and graphite/S-glass/epoxy. Specimens of the first six types were mechanically cycled up to 90% of static strength. Those that survived 10 million cycles were tested statically to failure, and no significant changes in residual strength and modulus were noted. Specimens of all types were subjected to thermal cycling between room temperature and 411 K for the epoxy-matrix composites and 533 K for the polyimide-matrix composites. The residual strength and stiffness remained largely unchanged, except for the graphite/low-modulus epoxy, which showed reductions in both of approximately 35%. When low-temperature thermal cycling under tensile load was applied, there was a noticeable reduction in modulus and strength in the graphite/low-modulus epoxy and some strength reduction in the S-glass/epoxy.