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Stitch-bond parallel-gap welding for IC circuitsStitch-bonded flatpacks are superior to soldered dual-in-lines where size, weight, and reliability are important. Results should interest designers of packaging for complex high-reliability electronics, such as that used in security systems, industrial process control, and vehicle electronics.
Document ID
19790000560
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Chvostal, P. (Odetics, Inc.)
Tuttle, J. (Odetics, Inc.)
Vanderpool, R. (Odetics, Inc.)
Date Acquired
August 10, 2013
Publication Date
June 1, 1980
Publication Information
Publication: NASA Tech Briefs
Volume: 4
Issue: 4
ISSN: 0145-319X
Subject Category
Fabrication Technology
Report/Patent Number
MSC-16459
Accession Number
79B10560
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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