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Thermal study of interface between the Orbiter cold plate and typical Shuttle spacecraft payload flight electronicsSpacelab provides a set of Freon line plumbing and cold plates for experiment equipments which are located in the Shuttle pallet and which need active thermal control. The reported study deals with the thermal problem of attaching a Command and Data Handling module with various electronic boxes whose combined footprints on the baseplate are much larger than the cold plate. A description of two modules and the cold plate assembly in the pallet is presented and a thermal model description is provided. The method employed in modeling heat pipes-honey-comb matrix is based upon an effective conductance between the heat pipe vapor and the walls of the heat pipe. The considered thermal models and a computer program are used to perform steady-state thermal analyses. The temperature gradients in the large module baseplate attached to the small cold plate are predicted as a function of the interface plate thickness.
Document ID
19790035567
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Hwangbo, H.
(System Development Corp. McLean, Va., United States)
Coyle, M. J.
(NASA Goddard Space Flight Center Thermophysics Branch, Greenbelt, Md., United States)
Date Acquired
August 9, 2013
Publication Date
January 1, 1979
Subject Category
Spacecraft Design, Testing And Performance
Report/Patent Number
AIAA PAPER 79-0180
Meeting Information
Meeting: American Institute of Aeronautics and Astronautics, Aerospace Sciences Meeting
Location: New Orleans, LA
Start Date: January 15, 1979
End Date: January 17, 1979
Sponsors: American Institute of Aeronautics, Astronautics
Accession Number
79A19580
Distribution Limits
Public
Copyright
Other

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