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The use of hybrid integrated circuit techniques in biotelemetry applicationsA review is presented of some features of hybrid integrated circuits that make their use advantageous in miniature biotelemetry applications. The various techniques for fabricating resistors, capacitors and interconnections by both thin film and thick film technology are discussed. The use of chip capacitors, resistors, and especially standard IC chips on substrates with fired-on interconnection patterns is emphasized. The review is designed primarily to acquaint biotelemetry users and designers with an overview of this fabrication technique so that they can better communicate their needs with an understanding of its limitations and advantages to facilities specializing in hybrid construction.
Document ID
Document Type
Reprint (Version printed in journal)
Fryer, T. B.
(NASA Ames Research Center Moffett Field, Calif., United States)
Date Acquired
August 9, 2013
Publication Date
January 1, 1977
Publication Information
Publication: Biotelemetry
Volume: 4
Issue: 4, 19
Subject Category
Man/System Technology And Life Support
Accession Number
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