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Heat conduction in three dimensionsMultidimensional heat conduction program computes transient temperature history and steady state temperatures of complex body geometries in three dimensions. Emphasis is placed on type of problems associated with Space Shuttle thermal protection system, but program could be used in thermal analysis of most three dimensional systems.
Document ID
19800000239
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Danza, T. M.
(Rockwell Intern. Corp.)
Fesler, L. W.
(Rockwell Intern. Corp.)
Mongan, R. D.
(Rockwell Intern. Corp.)
Date Acquired
August 10, 2013
Publication Date
September 1, 1980
Publication Information
Publication: NASA Tech Briefs
Volume: 5
Issue: 2
ISSN: 0145-319X
Subject Category
Mechanics
Report/Patent Number
MSC-18616
Accession Number
80B10239
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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