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Improved Cure-in-Place Silicone AdhesivesTwo improved cure-in-place silicone-elastomer-based adhesives have low thermal expansion and low thermal conductivity. Adhesives are flexible at low temperature and withstand high temperatures without disintegrating. New ablative compounds were initially developed for in-flight repair of insulating tile on Space Shuttle orbiter. Could find use in other applications requiring high-performance adhesives, such as sealants for solar collectors.
Document ID
19810000164
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Blevins, C. E.
(McDonnell Douglas Corp.)
Sweet, J.
(McDonnell Douglas Corp.)
Gonzalez, R.
(McDonnell Douglas Corp.)
Date Acquired
August 11, 2013
Publication Date
November 1, 1982
Publication Information
Publication: NASA Tech Briefs
Volume: 6
Issue: 2
ISSN: 0145-319X
Subject Category
Materials
Report/Patent Number
MSC-18782
Accession Number
81B10164
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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