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Integral glass encapsulation for solar arraysElectrostatic bonding technology, an encapsulation technique for terrestrial solar array was developed. The process produces full integral, hermetic bonds with no adhesives or pottants. Panels of six solar cells on a simple glass superstrate were produced. Electrostatic bonding for making the cell front contact was also developed. A metal mesh is trapped into contact with the cell front during the bonding process. Six cell panels using the bonded mesh as the only cell front contact were produced. The possibility of using lower cost glass, with a higher thermal expansion mismatch to silicon, by making lower temperature bonds is developed. However, this requires a planar surface cell.
Document ID
19810025062
Acquisition Source
Legacy CDMS
Document Type
Other
Authors
Landis, G. A.
(Spire Corp. Bedford, MA, United States)
Date Acquired
September 4, 2013
Publication Date
July 1, 1981
Subject Category
Energy Production And Conversion
Report/Patent Number
JPL-9950-589
DOE/JPL-954521-81/15
FR-81-10046
Accession Number
81N33605
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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