Contact integrity testing of stress-tested silicon terrestrial solar cellsA test procedure was developed and applied to terrestrial silicon solar cells in order to determine the effect of accelerated environmental and time-temperature aging on metal contact integrity. Quantities of cells of four different manufacturers were given the contact integrity test after being subjected to accelerated stress tests that included forward bias-temperature, thermal cycle and thermal shock, power cycle, and bias-temperature humidity tests at two temperature-humidity levels. Significant effects due to certain stress tests were found for some cell types. It is concluded that cells fabricated using plated nickel/solder metallization showed significantly more serious contact integrity degradation than silver-metallized cells.
Document ID
19810042820
Acquisition Source
Legacy CDMS
Document Type
Conference Proceedings
Authors
Prince, J. L. (Clemson Univ. SC, United States)
Lathrop, J. W. (Clemson University Clemson, S.C., United States)
Witter, G. W. (Arco Solar Chatsworth, Calif., United States)