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Record Details

Record 23 of 2631
Etching Integrated Circuits
Author and Affiliation:
Kennedy, B. W.
Abstract: 20-page report reviews methods available for etching specific layers on wafers and discusses automation techniques and features on one particular automated system. Compares two major etching methods, chemical (wet) and plasma (dry), and discusses areas in need of development. Methods covered include "dip-and-dunk" manual method of chemical etching, automated chemical etching, and plasma etching.
Publication Date: Mar 01, 1983
Document ID:
19820000238
(Acquired Nov 04, 1995)
Accession Number: 82B10238
Subject Category: FABRICATION TECHNOLOGY
Report/Patent Number: MFS-25661
Document Type: NASA Tech Brief
Publication Information: NASA Tech Briefs (ISSN 0145-319X); 7; 1; P. 108
Publisher Information: United States
Financial Sponsor: NASA; United States
Organization Source: NASA Marshall Space Flight Center; Huntsville, AL, United States
Description: In English
Distribution Limits: Unclassified; Publicly available; Unlimited
Rights: No Copyright
NASA Terms: ETCHING; FABRICATION; PRINTED CIRCUITS; WAFERS
Availability Source: National Technology Transfer Center (NTTC), Wheeling, WV
Availability Notes: See Also NASA TM-82411 (N81-74978/TB)
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