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Etching Integrated Circuits20-page report reviews methods available for etching specific layers on wafers and discusses automation techniques and features on one particular automated system. Compares two major etching methods, chemical (wet) and plasma (dry), and discusses areas in need of development. Methods covered include "dip-and-dunk" manual method of chemical etching, automated chemical etching, and plasma etching.
Document ID
19820000238
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Kennedy, B. W.
Date Acquired
August 10, 2013
Publication Date
March 1, 1983
Publication Information
Publication: NASA Tech Briefs
Volume: 7
Issue: 1
ISSN: 0145-319X
Subject Category
Fabrication Technology
Report/Patent Number
MFS-25661
Accession Number
82B10238
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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