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Plastic-Sealed Hybrid Power Circuit PackageProposed design for hybrid high-voltage power-circuit package uses molded plastic for hermetic sealing instead of glass-to-metal seal. New package used to house high-voltage regulators and solid-state switches for applications in aircraft, electric automobiles, industrial equipment, satellites, solarcell arrays, and other equipment in extreme environments.
Document ID
19820000338
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Miller, W. N.
(Rockwell International Corp.)
Gray, O. E.
(Rockwell International Corp.)
Date Acquired
August 10, 2013
Publication Date
May 1, 1983
Publication Information
Publication: NASA Tech Briefs
Volume: 7
Issue: 2
ISSN: 0145-319X
Subject Category
Fabrication Technology
Report/Patent Number
MSC-20181
Accession Number
82B10338
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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