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High-Production Silicon-Ingot SlicerNew concept for slicing silicon ingots into wafers promises to increase production rates and improve yields of good wafers, thereby reducing cost of manufacturing silicon solar cells. In proposed wafer slicer, stack of ganged blades cuts group of silicon ingots simultaneously. Blades cut horizontally while ingots rotate about their vertical axes.
Document ID
19820000351
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Kuo, Y. S.
(CALTECH)
Date Acquired
August 10, 2013
Publication Date
May 1, 1983
Publication Information
Publication: NASA Tech Briefs
Volume: 7
Issue: 2
ISSN: 0145-319X
Subject Category
Fabrication Technology
Report/Patent Number
NPO-15483
Accession Number
82B10351
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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