NASA Logo

NTRS

NTRS - NASA Technical Reports Server

Back to Results
Low-Cost Alternatives in Hybrid Microcircuit PackagingAdhesive sealing, nickel plating, and multiwire boards evaluated. Based on study involving fully developed hardware, report considers adhesive packaging instead of seam welding, nickel-plated Kovar (commercial Fe/NI/Co alloy) packages instead of gold plates ones, and multiwire circuit boards instead of multilayer boards as alternatives for reducing cost of hardware without reducing reliability.
Document ID
19830000236
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Caruso, S. V.
(Rockwell International Corp.)
Champion, V. L.
(Rockwell International Corp.)
Bassett, R. N.
(Rockwell International Corp.)
Gayer, J. N.
(Rockwell International Corp.)
Date Acquired
August 11, 2013
Publication Date
October 1, 1983
Publication Information
Publication: NASA Tech Briefs
Volume: 7
Issue: 4
ISSN: 0145-319X
Subject Category
Fabrication Technology
Report/Patent Number
MFS-25809
Accession Number
83B10236
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

Available Downloads

There are no available downloads for this record.
No Preview Available