Thermal mathematical modeling and system simulation of Space Shuttle less subsystem

Applications, validation tests, and upgrades of the two- and three-dimensional system level thermal mathematical system simulation models (TMSSM) used for thermal protection system (TPS) analyses are described. The TMSSM were developed as an aid to predicting the performance requirements and configurations of the Shuttle wing leading edge (WLE) and nose cone (NC) TPS tiles. The WLE and its structure were subjected to acoustic, thermal/vacuum, and air loads tests to simulate launch, on-orbit, and re-entry behavior. STS-1, -2 and -5 flight data led to recalibration of on-board instruments and raised estimates of the thermal shock at the NC and WLE. Baseline heating data are now available for the design of future TPS.