The development of aerospace polyimide adhesivesFew materials are available which can be used as aerospace adhesives at temperatures in the range of 300 C. The Materials Division at NASA-Langley Research Center developed several high temperature polyimide adhesives to fulfill the stringent needs of current aerospace programs. These adhesives are the result of a decade of basic research studies on the structure property relationships of both linear and addition aromatic polyimides. The development of both in house and commercially available polyimides is reviewed with regards to their potential for use as aerospace adhesives.
Document ID
19850039370
Acquisition Source
Legacy CDMS
Document Type
Conference Proceedings
Authors
St. Clair, A. K. (NASA Langley Research Center Hampton, VA, United States)
St. Clair, T. L. (NASA Langley Research Center Materials Div., Hampton, VA, United States)