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Ensuring Fully Soldered Through HolesSimple differential-pressure soldering method provides visual evidence that hidden joints are fully soldered. Intended for soldering connector pins in plated through holes in circuit boards. Molten solder flows into plated through holes, drawn by vacuum in manifold over circuit board. Differential-pressure process ensures solder wets entire through hole around connector pin.
Document ID
19870000246
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Blow, Raymond K. (Rockwell International Corp.)
Date Acquired
August 13, 2013
Publication Date
May 1, 1987
Publication Information
Publication: NASA Tech Briefs
Volume: 11
Issue: 5
ISSN: 0145-319X
Subject Category
Fabrication Technology
Report/Patent Number
MFS-29120
Accession Number
87B10246
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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