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Thermal Stresses in Silicon-Web GrowthMathematical model represents thermomechanical behavior of solid web of rectangular cross section as pulled from melt of same material. Intended for application to growth of silicon webs or ribbons, model general enough to be applicable to other materials as well. Shows suitable temperature distribution results in stress-free ribbon. Conceptual ribbon of rectangular cross section pulled from melt. Simplified configuration used to calculate thermal conditions for stress-free ribbon.
Document ID
19870000298
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Wade, Ben K.
(Caltech)
Utku, Senol
(Duke University)
Ray, Sujit Kumar
(Duke University)
Date Acquired
August 13, 2013
Publication Date
June 1, 1987
Publication Information
Publication: NASA Tech Briefs
Volume: 11
Issue: 6
ISSN: 0145-319X
Subject Category
Fabrication Technology
Report/Patent Number
NPO-16824
Accession Number
87B10298
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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