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Polyimides From BTDA, m-PDA, and HDAAliphatic segments in polyimide backbones achieve low molding temperatures and resistance to solvents. Low molding temperatures in combination with good solvent resistance make these polymers candidates for use in aerospace applications.
Document ID
19870000332
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Delano, Chadwick B. (Acurex Corp.)
Kiskiras, Charles J. (Acurex Corp.)
Date Acquired
August 13, 2013
Publication Date
July 1, 1987
Publication Information
Publication: NASA Tech Briefs
Volume: 11
Issue: 7
ISSN: 0145-319X
Subject Category
Materials
Report/Patent Number
LAR-13635
Accession Number
87B10332
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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