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Effects of temperature and moisture on module leakage currentsExperimental and analytical results are presented that characterize the rate dependency of leakage currents on environmental temperature and humidity level and quantify the influence of module construction features such as rear-surface films and foils, cell-frame gap spacings, and encapsulant resistivity and thickness. The relative roles of surface and bulk resistivity are illuminated together with their differing dependencies on surface moisture, bulk moisture, and temperature.
Document ID
19870032670
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Mon, G. (Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Wen, L. (Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Ross, R. G., Jr. (Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Adent, D. (California Institute of Technology Jet Propulsion Laboratory, Pasadena, United States)
Date Acquired
August 13, 2013
Publication Date
January 1, 1985
Subject Category
Electronics And Electrical Engineering
Accession Number
87A19944
Distribution Limits
Public
Copyright
Other

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