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Record 12 of 208
Prediction and rational correlation of thermophoretically reduced particle mass transfer to hot surfaces across laminar or turbulent forced-convection gas boundary layers
Author and Affiliation:
Gokoglu, Suleyman A.(NASA Lewis Research Center, Cleveland, OH, United States)
Rosner, Daniel E.(Yale University, New Haven, CT, United States)
Abstract: A formulation previously developed to predict and correlate the thermophoretically-augmented submicron particle mass transfer rate to cold surfaces is found to account for the thermophoretically reduced particle mass transfer rate to overheated surfaces such that thermophoresis brings about a 10-decade reduction below the convective mass transfer rate expected by pure Brownian diffusion and convection alone. Thermophoretic blowing is shown to produce effects on particle concentration boundary-layer (BL) structure and wall mass transfer rates similar to those produced by real blowing through a porous wall. The applicability of the correlations to developing BL-situations is demonstrated by a numerical example relevant to wet-steam technology.
Publication Date: Jan 01, 1986
Document ID:
19870036175
(Acquired Nov 28, 1995)
Accession Number: 87A23449
Subject Category: FLUID MECHANICS AND HEAT TRANSFER
Document Type: Journal Article
Publication Information: Chemical Engineering Communications (ISSN 0098-6445); 44; 107-119
Publisher Information: United Kingdom
Contract/Grant/Task Num: AF-AFOSR-84-0034; NAG3-590; NCC3-45
Financial Sponsor: NASA; United States
Organization Source: NASA Lewis Research Center; Cleveland, OH, United States
Yale Univ.; New Haven, CT, United States
Description: 13p; In English
Distribution Limits: Unclassified; Publicly available; Unlimited
Rights: Copyright
NASA Terms: FORCED CONVECTION; HOT SURFACES; LAMINAR BOUNDARY LAYER; MASS TRANSFER; THERMOPHORESIS; TURBULENT BOUNDARY LAYER; DEPOSITION; TEMPERATURE DISTRIBUTION; WALL FLOW
Imprint And Other Notes: Chemical Engineering Communications (ISSN 0098-6445), vol. 44, 1986, p. 107-119.
Availability Source: Other Sources
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