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The role of boron in ductilizing Ni3AlDuctilization of Ni3Al at room temperature by microalloying with boron has been primarily attributed to the increased grain boundary cohesion in the presence of boron. However, another aspect of the role played by boron in ductilizing Ni3Al is revealed when the Hall-Petch relationships for Ni3Al and B-doped Ni3Al are compared. A shallower slope for the B-doped Ni3Al compared to that for Ni3Al indicates a reduced resistance to slip propagation across grain boundaries, and therefore reduced stress concentration at boundaries, in the presence of boron. This comparison of Hall-Petch relationships was carried out by generating data for powder processed B-doped Ni3Al at various grain sizes and by compiling data for Ni3Al from the literature. In addition, the room temperature fracture of B-doped Ni3Al has been shown to initiate along certain grain boundaries. The fracture eventually occurs by transgranular ductile tearing.
Document ID
19870048075
Acquisition Source
Legacy CDMS
Document Type
Reprint (Version printed in journal)
Authors
Vedula, K.
(Case Western Reserve University Cleveland, OH, United States)
Shabel, B. S.
(Alcoa Laboratories, Alcoa Center PA, United States)
Khadkikar, P. S.
(Case Western Reserve Univ. Cleveland, OH, United States)
Date Acquired
August 13, 2013
Publication Date
March 1, 1987
Publication Information
Publication: Metallurgical Transactions A - Physical Metallurgy and Materials Science
Volume: 18A
ISSN: 0360-2133
Subject Category
Metallic Materials
Accession Number
87A35349
Distribution Limits
Public
Copyright
Other

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