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Dynamic and static fatigue behavior of sintered silicon nitridesThe dynamic and static fatigue behavior of Kyocera SN220M sintered silicon nitride at 1000 C was studied. Fractographic analysis of the material failing in dynamic fatigue revealed the presence of slow crack growth (SCG) at stressing rates below 41 MPa/min. Under conditions of static fatigue this material also displayed SCG at stresses below 345 MPa. SCG appears to be controlled by microcracking of the grain boundaries. The crack velocity exponent (n) determined from both dynamic and static fatigue tests ranged from 11 to 16.
Document ID
19880025375
Acquisition Source
Legacy CDMS
Document Type
Reprint (Version printed in journal)
Authors
Chang, J. (General Motors Corp. Indianapolis, IN, United States)
Khandelwal, P. (General Motors Corp. Indianapolis, IN, United States)
Heitman, P. W. (General Motors Corp. Allison Gas Turbine Div., Indianapolis, IN, United States)
Date Acquired
August 13, 2013
Publication Date
August 1, 1987
Publication Information
Publication: Ceramic Engineering and Science Proceedings
Volume: 8
ISSN: 0196-6219
Subject Category
Nonmetallic Materials
Accession Number
88A12602
Funding Number(s)
CONTRACT_GRANT: DEN3-168
Distribution Limits
Public
Copyright
Other

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