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Record 1 of 4864
Effect of temperature, microstructure, and stress state on the low cycle fatigue behavior of Waspaloy
Author and Affiliation:
Stahl, D. R.(Georgia Inst. of Tech., Atlanta, GA, United States)
Antolovich, S. D.(Georgia Institute of Technology, Atlanta, United States)
Mirdamadi, M.(Georgia Inst. of Tech., Atlanta, GA, United States)
Zamrik, S. Y.(Pennsylvania State University, University Park, United States)
Abstract: Specimens of Waspaloy of two different microstructures were tested in uniaxial and torsional low-cycle fatigue at 24 and 649 C. For all specimens, deformation and failure mechanisms are found to be independent of stress state at 24 C; in both microstructures, failure is associated with the formation of shear cracks. At 649 C, deformation and failure mechanisms for the fine-grain large gamma-prime specimens are independent of stress state, and the mechanisms are similar to those observed at 24 C. For the coarse-grain small gamma-prime specimens, however, failure occurs on principal planes in torsion and on shear plane in uniaxial tension. The results are interpreted in terms of deformation mode and microstructural instability.
Publication Date: Jan 01, 1988
Document ID:
19880048695
(Acquired Nov 28, 1995)
Accession Number: 88A35922
Subject Category: METALLIC MATERIALS
Document Type: Conference Proceedings
Publication Information: (SEE A88-35901)
Publisher Information: United States
Contract/Grant/Task Num: NAG3-264
Financial Sponsor: NASA; United States
Organization Source: Georgia Inst. of Tech.; Atlanta, GA, United States
Pennsylvania State Univ.; University Park, PA, United States
Description: 23p; In English
Distribution Limits: Unclassified; Publicly available; Unlimited
Rights: Copyright
NASA Terms: HEAT RESISTANT ALLOYS; METAL FATIGUE; MICROSTRUCTURE; THERMAL CYCLING TESTS; THERMAL FATIGUE; WASPALOY; FAILURE ANALYSIS; GRAIN SIZE; HEAT TREATMENT; HIGH TEMPERATURE TESTS; NICKEL ALLOYS
Imprint And Other Notes: IN: Low cycle fatigue (A88-35901 14-26). Philadelphia, PA, American Society for Testing and Materials, 1988, p. 728-750.
Availability Source: Other Sources
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