The use of fluoroepoxy compounds as adhesives to bond fluoroplastics without any surface treatment

The use of fluoroepoxy compounds as adhesives to bond fluoroplastics was investigated. Fluoroepoxy compounds with a F-content higher than 46 percent were able to bond a highly fluorinated plastic such as Teflon PTFE (76 percent F) to give a respectable bond strength without any surface treatment. The advantage of the fluoroepoxy adhesive vanished when applied to a less fluorinated plastic such as Tefzel which contains 55 percent fluorine. Among the curing agents explored, octafluorooctamethylenediamine showed its potential as a cocuring agent for improving both the viscosity of the compound and the flexibility of the cured product.