Deterioration of ZnO/SiO2 diode packages in high humidityA case study is reported in which the ZnO/SiO2 glass used to package a power rectifier combined with the design to produce a catastropic corrosion failure of the system. Metallic Zn inclusions, present in the glass, played a critical role in creating a conductive path for corrosion currents. Actual equipment failure was the result of an open circuit trace created by corrosion. It is concluded that the presence of Zn inclusions in the glass of this type of package may result in long-term reliability problems for equipment used in high humidity environments.
Document ID
19880068075
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Evans, John (NASA Goddard Space Flight Center; Unisys Corp. Greenbelt, MD, United States)
Wagner, Scott (Rockwell International Corp. Collins Defense Communications Div., Cedar Rapids, IA, United States)
Date Acquired
August 13, 2013
Publication Date
January 1, 1987
Subject Category
Quality Assurance And Reliability
Meeting Information
Meeting: ISTFA 1987 - International Symposium for Testing and Failure Analysis: Microelectronics