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Low-Thermal-Expansion Filled PolytetrafluoroethylenePTFE made thermally compatible with aluminum without changing dielectric constant. Manufactured with fillers and pores to reduce coefficient of thermal expansion by factor of 6 to match aluminum. Material retains 2.1 dielectric constant of pure PTFE. Combines filler and micropore concepts. Particles and voids embedded in PTFE matrix function cooperatively. Particles take up compressive stress imposed by contracting PTFE, and voids take up expanding material. Increases dielectric constant, while voids reduce it.
Document ID
19890000068
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Shapiro, Sanford S.
(Hughes Aircraft Co.)
Date Acquired
August 13, 2013
Publication Date
February 1, 1989
Publication Information
Publication: NASA Tech Briefs
Volume: 13
Issue: 2
ISSN: 0145-319X
Subject Category
Materials
Report/Patent Number
NPO-17189
Accession Number
89B10068
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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