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Low-Thermal-Expansion Filled Polytetrafluoroethylene
Author and Affiliation:
Shapiro, Sanford S.(Hughes Aircraft Co.)
Abstract: PTFE made thermally compatible with aluminum without changing dielectric constant. Manufactured with fillers and pores to reduce coefficient of thermal expansion by factor of 6 to match aluminum. Material retains 2.1 dielectric constant of pure PTFE. Combines filler and micropore concepts. Particles and voids embedded in PTFE matrix function cooperatively. Particles take up compressive stress imposed by contracting PTFE, and voids take up expanding material. Increases dielectric constant, while voids reduce it.
Publication Date: Feb 01, 1989
Document ID:
19890000068
(Acquired Nov 04, 1995)
Accession Number: 89B10068
Subject Category: MATERIALS
Report/Patent Number: NPO-17189
Document Type: NASA Tech Brief
Publication Information: NASA Tech Briefs (ISSN 0145-319X); 13; 2; P. 60
Publisher Information: United States
Financial Sponsor: NASA; United States
Organization Source: Jet Propulsion Lab., California Inst. of Tech.; Pasadena, CA, United States
Description: In English
Distribution Limits: Unclassified; Publicly available; Unlimited
Rights: No Copyright
NASA Terms: DIELECTRICS; INSULATORS; POLYTETRAFLUOROETHYLENE
Availability Source: National Technology Transfer Center (NTTC), Wheeling, WV
Availability Notes: Additional information available through: National Technology Transfer Center (NTTC), Wheeling, WV 26003, (Tel: 1-800-678-6882).
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