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Record Details

Record 43 of 46878
High-Capacity Heat-Pipe Evaporator
Author and Affiliation:
Oren, J. A.(LTV Corp.)
Duschatko, R. J.(LTV Corp.)
Voss, F. E.(LTV Corp.)
Sauer, L. W.(LTV Corp.)
Abstract: Heat pipe with cylindrical heat-input surface has higher contact thermal conductance than one with usual flat surface. Cylindrical heat absorber promotes nearly uniform flow of heat into pipe at all places around periphery of pipe, helps eliminate hotspots on heat source. Lugs in aluminum pipe carry heat from outer surface to liquid oozing from capillaries of wick. Liquid absorbs heat, evaporates, and passes out of evaporator through interlug passages.
Publication Date: Feb 01, 1989
Document ID:
(Acquired Nov 04, 1995)
Accession Number: 89B10078
Subject Category: MECHANICS
Report/Patent Number: MSC-21272
Document Type: NASA Tech Brief
Publication Information: NASA Tech Briefs; p. P. 73; (ISSN 0145-319X); 13; 2
Publisher Information: United States
Financial Sponsor: NASA; United States
Organization Source: NASA Johnson Space Center; Houston, TX, United States
Description: In English
Distribution Limits: Unclassified; Publicly available; Unlimited
Rights: No Copyright
Availability Source: National Technology Transfer Center (NTTC), Wheeling, WV
Availability Notes: Additional information available through: National Technology Transfer Center (NTTC), Wheeling, WV 26003, (Tel: 1-800-678-6882).
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