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Test Structures For Bumpy Integrated CircuitsCross-bridge resistors added to comb and serpentine patterns. Improved combination of test structures built into integrated circuit used to evaluate design rules, fabrication processes, and quality of interconnections. Consist of meshing serpentines and combs, and cross bridge. Structures used to make electrical measurements revealing defects in design or fabrication. Combination of test structures includes three comb arrays, two serpentine arrays, and cross bridge. Made of aluminum or polycrystalline silicon, depending on material in integrated-circuit layers evaluated. Aluminum combs and serpentine arrays deposited over steps made by polycrystalline silicon and diffusion layers, while polycrystalline silicon versions of these structures used to cross over steps made by thick oxide layer.
Document ID
19890000426
Document Type
Other - NASA Tech Brief
Authors
Buehler, Martin G.
(Caltech)
Sayah, Hoshyar R.
(Caltech)
Date Acquired
August 14, 2013
Publication Date
September 1, 1989
Publication Information
Publication: NASA Tech Briefs
Volume: 13
Issue: 9
ISSN: 0145-319X
Subject Category
Electronic Components And Circuits
Report/Patent Number
NPO-17393
Accession Number
89B10426
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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