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Healing Voids In Interconnections In Integrated CircuitsUnusual heat treatment heals voids in aluminum interconnections on integrated circuits (IC's). Treatment consists of heating IC to temperature between 200 degrees C and 400 degrees C, holding it at that temperature, and then plunging IC immediately into liquid nitrogen. Typical holding time at evaluated temperature is 30 minutes.
Document ID
19890000484
Document Type
Other - NASA Tech Brief
Authors
Cuddihy, Edward F.
(Caltech)
Lawton, Russell A.
(Caltech)
Gavin, Thomas
(Caltech)
Date Acquired
August 14, 2013
Publication Date
September 1, 1989
Publication Information
Publication: NASA Tech Briefs
Volume: 13
Issue: 9
ISSN: 0145-319X
Subject Category
Fabrication Technology
Report/Patent Number
NPO-17678
Accession Number
89B10484
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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