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Removing Bonded Integrated Circuits From BoardsSmall resistance heater makes it easier, faster, and cheaper to remove integrated circuit from hybrid-circuit board, package, or other substrate for rework. Heater, located directly in polymeric bond interface or on substrate under integrated-circuit chip, energized when necessary to remove chip. Heat generated softens adhesive or solder that bonds chip to substrate. Chip then lifted easily from substrate.
Document ID
19890000570
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Rice, John T.
(Caltech)
Date Acquired
August 14, 2013
Publication Date
November 1, 1989
Publication Information
Publication: NASA Tech Briefs
Volume: 13
Issue: 11
ISSN: 0145-319X
Subject Category
Fabrication Technology
Report/Patent Number
NPO-17031
Accession Number
89B10570
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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