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Record Details

Record 1 of 26882
Removing Bonded Integrated Circuits From Boards
Author and Affiliation:
Rice, John T.(Caltech)
Abstract: Small resistance heater makes it easier, faster, and cheaper to remove integrated circuit from hybrid-circuit board, package, or other substrate for rework. Heater, located directly in polymeric bond interface or on substrate under integrated-circuit chip, energized when necessary to remove chip. Heat generated softens adhesive or solder that bonds chip to substrate. Chip then lifted easily from substrate.
Publication Date: Nov 01, 1989
Document ID:
19890000570
(Acquired Nov 04, 1995)
Accession Number: 89B10570
Subject Category: FABRICATION TECHNOLOGY
Report/Patent Number: NPO-17031
Document Type: NASA Tech Brief
Publication Information: NASA Tech Briefs (ISSN 0145-319X); 13; 11; P. 66
Publisher Information: United States
Financial Sponsor: NASA; United States
Organization Source: Jet Propulsion Lab., California Inst. of Tech.; Pasadena, CA, United States
Description: In English
Distribution Limits: Unclassified; Publicly available; Unlimited
Rights: No Copyright
NASA Terms: CIRCUIT BOARDS; INTEGRATED CIRCUITS; RESISTANCE HEATING
Availability Source: National Technology Transfer Center (NTTC), Wheeling, WV
Availability Notes: Additional information available through: National Technology Transfer Center (NTTC), Wheeling, WV 26003, (Tel: 1-800-678-6882).
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