Enclosed Cutting-And-Polishing Apparatus

Proposed apparatus cuts and polishes specimens while preventing contamination of outside environment or of subsequent specimens processed in it. Designed for use in zero gravity but also includes features useful in cutting and polishing of toxic or otherwise hazardous materials on Earth. Includes remote manipulator for handling specimens, cutting and polishing wire, inlets for gas and liquid, and outlets for waste liquid and gas. Replaceable plastic liner surrounds working space.