Frequency-dependent dielectric analysis - Monitoring the chemistry and rheology of thermosets during cure

Frequency-dependent dielectric measurements in a curing resin sample were performed using an impedance analyzer and a permittivity sensor, to separate and measure the ionic (sigma) and dipolar (tau) mobilities, used as molecular probes of the cure reaction in the resin. The resin samples were tetraglycidyl 4,4-prime-diaminodiphenylmethane epoxy resins which included catalyzed (Hercules 3501-6) and uncatalyzed l3502 resin samples. The values of sigma and tau were used to quantitatively determine the viscosity, the degree of cure, and the T(g) of the resin. It is shown that the values of the Arrhenius and WLF constants during the cure process reflect the buildup of the crosslink network.