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Initial evaluation of novel polyamide-imides and their copolymers as adhesivesContinued interest by the research community in thermally stable, tough, high temperature adhesives has resulted in the investigation by Langley Research Center of two linear aromatic polyamide-imide (PAI) homopolymers and two linear aromatic PAI copolymers. The homopolymers were made with either 3,3'=DABA or 4,4'-DABA and BTDA. The two polymers were prepared with a monomer ratio of 0.75 DABP:0.25 DABA:1.00 BTDA. These aromatic PAIs possess high thermal stability because of intermolecular hydrogen bonding and chain stiffness. Lap shear strength (LSS) was the main criteria used to evaluate the polymers as adhesives. LSS of bonded Ti-6Al-4V was determined at room temperature (RT), 177, 204 and 232 C. The glass transition temperature and the type of bond failure were also determined. The best LSS values of the four adhesive systems investigated were obtained with the PAI copolymer identified in the report as LARC-TPI (25 percent 3,3'-DABA); however, it did not produce LSSs nearly as high as LARC-TPI. The poor flow properties observed appear to be due to a combination of high molecular weight and the increased interchain electronic interactions associated with the amide group.
Document ID
19890061091
Acquisition Source
Legacy CDMS
Document Type
Reprint (Version printed in journal)
Authors
Progar, Donald J.
(NASA Langley Research Center Hampton, VA, United States)
Dezern, James F.
(NASA Langley Research Center Hampton, VA, United States)
Date Acquired
August 14, 2013
Publication Date
January 1, 1989
Publication Information
Publication: Journal of Adhesion Science and Technology
Volume: 3
Issue: 4, 19
ISSN: 0169-4243
Subject Category
Nonmetallic Materials
Accession Number
89A48462
Distribution Limits
Public
Copyright
Other

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