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Thermal-Interaction Matrix For Resistive Test StructureLinear mathematical model predicts increase in temperature in each segment of 15-segment resistive structure used to test electromigration. Assumption of linearity based on fact: equations that govern flow of heat are linear and coefficients in equations (heat conductivities and capacities) depend only weakly on temperature and considered constant over limited range of temperature.
Document ID
19900000148
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Buehler, Martin G.
(Caltech)
Dhiman, Jaipal K.
(Caltech)
Zamani, Nasser
(Caltech)
Date Acquired
August 14, 2013
Publication Date
April 1, 1990
Publication Information
Publication: NASA Tech Briefs
Volume: 14
Issue: 4
ISSN: 0145-319X
Subject Category
Electronic Components And Circuits
Report/Patent Number
NPO-17673
Accession Number
90B10148
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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