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Splicing Wires Permanently With ExplosivesExplosive joining process developed to splice wires by enclosing and metallurgically bonding wires within copper sheets. Joints exhibit many desirable characteristics, 100-percent conductivity and strength, no heat-induced annealing, no susceptibility to corrosion in contacts between dissimilar metals, and stability at high temperature. Used to join wires to terminals, as well as to splice wires. Applicable to telecommunications industry, in which millions of small wires spliced annually.
Document ID
19900000605
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Bement, Laurence J.
(NASA Langley Research Center, Hampton, VA.)
Kushnick, Anne C.
(PRC Kentron, Inc.)
Date Acquired
August 14, 2013
Publication Date
November 1, 1990
Publication Information
Publication: NASA Tech Briefs
Volume: 14
Issue: 11
ISSN: 0145-319X
Subject Category
Fabrication Technology
Report/Patent Number
LAR-13825
Accession Number
90B10605
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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