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Aeolian removal of dust from radiator surfaces on MarsSimulated radiator surfaces made of arc-textured Cu and Nb-1 percent-Zr and ion beam textured graphite and C-C composite were fabricated and their integrated spectral emittance characterized from 300 to 3000 K. A thin layer of aluminum oxide, basalt, or iron (III) oxide dust was then deposited on them, and they were subjected to low pressure winds in the Martian Surface Wind Tunnel. It was found that dust deposited on simulated radiator surfaces may or may not seriously lower their integrated spectral emittance, depending upon the characteristics of the dust. With Al2O3 there is no appreciable degradation of emittance on a dusted sample, with basaltic dust there is a 10 to 20 percent degradation, and with Fe2O3 a 20 to 40 percent degradation. It was also found that very high winds on dusted highly textured surfaces can result in their abrasion. Degradation in emittance due to abrasion was found to vary with radiator material. Arc-textured Cu and Nb-1 percent Zr was found to be more susceptible to emittance degradation than graphite or C-C composite. The most abrasion occurred at low angles, peaking at the 22.5 deg test samples.
Document ID
19900016752
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Gaier, James R.
(NASA Lewis Research Center Cleveland, OH., United States)
Perez-Davis, Marla E.
(NASA Lewis Research Center Cleveland, OH., United States)
Rutledge, Sharon K.
(NASA Lewis Research Center Cleveland, OH., United States)
Hotes, Deborah
(Cleveland State Univ. OH., United States)
Date Acquired
September 6, 2013
Publication Date
August 1, 1990
Subject Category
Spacecraft Propulsion And Power
Report/Patent Number
E-5547
NAS 1.15:103205
NASA-TM-103205
Meeting Information
Meeting: AIChE Summer National Meeting
Location: San Diego, CA
Country: United States
Start Date: August 19, 1990
End Date: August 22, 1990
Accession Number
90N26068
Funding Number(s)
PROJECT: RTOP 591-14-41
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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