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Record Details

Record 50 of 2666
Interpenetrating polymer networks from acetylene terminated materials
Author and Affiliation:
Connell, J. W.(NASA Langley Research Center, Hampton, VA, United States)
Hergenrother, P. M.(NASA Langley Research Center, Hampton, VA, United States)
Abstract: As part of a program to develop high temperature/high performance structural resins for aerospace applications, the chemistry and properties of a novel class of interpenetrating polymer networks (IPNs) were investigated. These IPNs consist of a simple diacetylenic compound (aspartimide) blended with an acetylene terminated arylene ether oligomer. Various compositional blends were prepared and thermally cured to evaluate the effect of crosslink density on resin properties. The cured IPNs exhibited glass transition temperatures ranging from 197 to 254 C depending upon the composition and cure temperature. The solvent resistance, fracture toughness and coefficient of thermal expansion of the cured blends were related to the crosslink density. Isothermal aging of neat resin moldings, adhesive and composite specimens showed a postcure effect which resulted in improved elevated temperature properties. The chemistry, physical and mechanical properties of these materials will be discussed.
Publication Date: Jan 01, 1989
Document ID:
19900046092
(Acquired Nov 28, 1995)
Accession Number: 90A33147
Subject Category: NONMETALLIC MATERIALS
Document Type: Conference Paper
Publication Information: (SEE A90-33076)
Publisher Information: United States
Meeting Information: International SAMPE Technical Conference; 21st; Sept. 25-28, 1989; Atlantic City, NJ; United States
Financial Sponsor: NASA; United States
Organization Source: NASA Langley Research Center; Hampton, VA, United States
Description: 12p; In English
Distribution Limits: Unclassified; Publicly available; Unlimited
Rights: Copyright
NASA Terms: ACETYL COMPOUNDS; POLYMER BLENDS; POLYMER CHEMISTRY; POLYMER PHYSICS; CROSSLINKING; GLASS TRANSITION TEMPERATURE; MECHANICAL PROPERTIES; POLYMERIC FILMS
Imprint And Other Notes: IN: International SAMPE Technical Conference, 21st, Atlantic City, NJ, Sept. 25-28, 1989, Proceedings (A90-33076 13-23). Covina, CA, Society for the Advancement of Material and Process Engineering, 1989, p. 1029-1040.
Availability Source: Other Sources
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