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Novel fabrication technique for improving the figure-of-merit of thermoelectric materialsReduction of the thermal conductivity of thermoelectric materials in order to improve the figure of merit and, hence, the conversion efficiency is discussed. A novel fabrication technique that reduces the thermal conductivity without too adverse an effect on the electrical properties is reported. This is achieved by producing an oxygen-free, very-fine-grain SiGe alloy with very small (on the order of 50 A) precipitates.
Document ID
19900051081
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Beaty, J. S.
(Thermo Electron Corp. Waltham, MA, United States)
Masters, R.
(Thermo Electron Technologies Corp. Waltham, MA, United States)
Vandersande, J. W.
(Thermo Electron Corp. Waltham, MA, United States)
Wood, C.
(JPL Pasadena, CA, United States)
Date Acquired
August 14, 2013
Publication Date
January 1, 1989
Subject Category
Solid-State Physics
Meeting Information
Meeting: IECEC-89
Location: Washington, DC
Country: United States
Start Date: August 6, 1989
End Date: August 11, 1989
Accession Number
90A38136
Distribution Limits
Public
Copyright
Other

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