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Thermal management of closed computer modules utilizing high density circuitryThis paper presents data on a preliminary analysis of the thermal dynamic characteristics of the Airborne Information Management System (AIMS), which is a continuing design project at NASA Dryden. The analysis established the methods which will be applied to the actual AIMS boards as they become available. The paper also describes the AIMS liquid cooling system design and presents a thermodynamic computer model of the AIMS cooling system, together with an experimental validation of this model.
Document ID
19900051386
Document Type
Conference Paper
Authors
Hoadley, A. W. (University of Western Michigan Kalamazoo, MI, United States)
Porter, A. J. (Western Michigan University Kalamazoo, MI, United States)
Date Acquired
August 14, 2013
Publication Date
June 1, 1990
Subject Category
AIRCRAFT INSTRUMENTATION
Report/Patent Number
AIAA PAPER 90-1748
Funding Number(s)
CONTRACT_GRANT: NCC2-493
Distribution Limits
Public
Copyright
Other