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High-Temperature Insulating Gap FillerNew inorganic, ceramic filler for gaps between refractory ceramic tiles offers high resistance to heat and erosion. Consists of ceramic-fiber fabric precoated with silica and further coated with silica containing small amount of silicon carbide powder to increase thermal emittance. Developed as replacement for organic filler used on thermal-protection system of Space Shuttle. Promises to serve for many missions and to reduce cost and delay of refurbishing aerospace craft. Used as sealing material in furnaces or as heat shield for sensitive components in automobiles, aircraft, and home appliances.
Document ID
19910000318
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Toombs, Gordon R.
(Rockwell International Corp.)
Oyoung, Kevin K.
(Rockwell International Corp.)
Stevens, Everett G.
(Rockwell International Corp.)
Date Acquired
August 14, 2013
Publication Date
July 1, 1991
Publication Information
Publication: NASA Tech Briefs
Volume: 15
Issue: 7
ISSN: 0145-319X
Subject Category
Materials
Report/Patent Number
MSC-21644
Accession Number
91B10318
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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