Splat-quench solidification of freely falling liquid-metal drops by impact on a planar substrate

Results are presented of a study of the splat-quench solidification of small, freely falling liquid drops of the alloy Nitronic 40W, which were allowed to impact on a solid, planar, horizontal substrate. The principal variable was the substrate material, with substrates of copper, alumina and fused quartz being used. The shapes of the solidified splats were correlated with a simplified model for the energetics of the splatting process and with the thermal conductivity of the substrate. The measured results are qualitatively in agreement with theoretical predictions, and suggestions are offered for a more comprehensive model of splat-quench solidification. A relationship between sessile droplet diameter and parent wire diameter is also presented and discussed.