NDE of adhesive bonds and bondlines; Proceedings of the 1989 ASNT Fall Conference, Valley Forge, PA, Oct. 9-13, 1989

The conference presents papers on the Solid Propulsion Integrity Program, the NDE methodology of adhesive bond strength determination, and an interface layer model for ultrasonic inspection of adhesive bonds. Also considered are pulse/echo ultrasonic methods for inspecting bondlines, ultrasonic detection of kissing bonds in adhesive joints, and the NDE needs and requirements for SRM bondline inspection. Thermographic stress analysis of bonded joints is discussed as well as the filmless and real-time applications of holography.