Electronic assembly thermal testing - Dwell/duration/cyclingTesting of electronic assemblies varies throughout industry, NASA, and the military. Differences include test levels, atmospheric versus vacuum testing of assemblies, dwell durations at temperature extremes (especially high temperature), and thermal cycling versus dwell testing. Of particular interest are the different philosophies of thermal cycling versus single-cycle thermal dwell. An examination of the various failure physics for electronic assemblies has been initiated at JPL. The intent is to determine which failure modes are best revealed by thermal cycling testing and which are susceptible to high-temperature dwell physics. Preliminary results of this study are presented, along with discussions of testing goals, flight environments, reliability models, and the differences between industry and JPL design/test approaches.
Document ID
19910045079
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Gibbel, Mark (Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Clawson, James F. (JPL Pasadena, CA, United States)
Date Acquired
August 14, 2013
Publication Date
January 1, 1990
Subject Category
Quality Assurance And Reliability
Meeting Information
Meeting: Aerospace Testing Seminar
Location: Manhattan Beach, CA
Country: United States
Start Date: March 13, 1990
End Date: March 15, 1990
Sponsors: Institute of Environmental Sciences and Aerospace Corp.