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A silicon micromachined piezoresistive accelerometer for health and condition monitoringSilicon micromachining etching techniques were utilized to batch-fabricate hundreds of general purpose microaccelerometers on a single silicon substrate. Piezoresistive sensing elements were aligned to the back-side patterns using an IR mask aligner and then diffused into the areas of maximum stress. Capping of the two-arm cantilever beam structure was achieved using a combination of electrostatic bonding and low temperature glass films. Overrange protection, critical damping, and overall protection from the outside environment are achieved by controlling the cavity depths of the top and bottom covers. Temperature compensation, amplification, and filtering are performed by a companion LSI chip that is interfaced to the accelerometer by conventional wire-bonding techniques.
Document ID
19910046022
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Walsh, Kevin M.
(Cincinnati Univ. OH, United States)
Henderson, H. Thurman
(NASA Health Monitoring Technology Center for Space Propulsion Systems; Cincinnati, University OH, United States)
Date Acquired
August 14, 2013
Publication Date
January 1, 1990
Subject Category
Instrumentation And Photography
Meeting Information
Meeting: Annual Health Monitoring Conference for Space Propulsion Systems
Location: Cincinnati, OH
Country: United States
Start Date: November 14, 1990
End Date: November 15, 1990
Accession Number
91A30645
Distribution Limits
Public
Copyright
Other

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