Application of strain gages to measure adhesive strains through the thickness of an adhesively-bonded stiffened strip

The purpose of the study is to measure the through-the-thickness strain distribution in an adhesively bonded stiffened strip subject to four-point bending and to compare the distribution with predicted results. Small-strain gages are used for measuring the normal strain in the adhesive layer of the strip. A total of 16 120-ohm encapsulated strain gages were mounted on the adhesive layer, and the specimen was loaded quasi-statistically and never to failure. Both the experimental and analytical results show good correlation and, in particular, a high strain gradient acting near the edge of the adhesive layer.