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Record 1 of 29799
The mode III crack problem in bonded materials with a nonhomogeneous interfacial zone
Author and Affiliation:
Erdogan, F.(Lehigh Univ., Bethlehem, PA, United States)
Joseph, P. F.(Lehigh University, Bethlehem, PA, United States)
Kaya, A. C.(Middle East Technical University, Ankara, Turkey)
Abstract: The mode 3 crack problem for two bonded homogeneous half planes was considered. The interfacial zone was modelled by a nonhomogeneous strip in such a way that the shear modulus is a continuous function throughout the composite medium and has discontinuous derivatives along the boundaries of the interfacial zone. The problem was formulated for cracks perpendicular to the nominal interface and was solved for various crack locations in and around the interfacial region. The asymptotic stress field near the tip of a crack terminating at an interface was examined and it was shown that, unlike the corresponding stress field in piecewise homogeneous materials, in this case the stresses have the standard square root singularity and their angular variation was identical to that of a crack in a homogeneous medium. With application to the subcritical crack growth process in mind, the results given include mostly the stress intensity factors for some typical crack geometries and various material combinations.
Publication Date: Jun 01, 1991
Document ID:
19910058309
(Acquired Nov 28, 1995)
Accession Number: 91A42932
Subject Category: STRUCTURAL MECHANICS
Document Type: Journal Article
Publication Information: ASME, Transactions, Journal of Applied Mechanics (ISSN 0021-8936); 58; 419-427
Publisher Information: United States
Contract/Grant/Task Num: NSF MSM-86-13611; NAG1-713
Financial Sponsor: NASA; United States
Organization Source: Lehigh Univ.; Bethlehem, PA, United States
Middle East Technical Univ.; Ankara, Turkey
Description: 9p; In English
Distribution Limits: Unclassified; Publicly available; Unlimited
Rights: Copyright
NASA Terms: CRACK GEOMETRY; CRACK PROPAGATION; CRACK TIPS; INHOMOGENEITY; STRESS DISTRIBUTION; ASYMPTOTIC PROPERTIES; CRACK OPENING DISPLACEMENT; FAILURE ANALYSIS; HALF PLANES; INTEGRAL EQUATIONS; MODULUS OF ELASTICITY; SHEAR STRENGTH; STRESS INTENSITY FACTORS
Imprint And Other Notes: (ASME, Joint Applied Mechanics Bioengineering Conference, Columbus, OH, June 16-19, 1991) ASME, Transactions, Journal of Applied Mechanics (ISSN 0021-8936), vol. 58, June 1991, p. 419-427. Research supported by Semiconductor Research Corp. Previously announced in STAR as N89-23927.
Miscellaneous Notes: Research supported by Semiconductor Research Corp. Previously announced in STAR as N89-23927
Availability Source: Other Sources
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