Vacuum bag bonding with a high temperature adhesiveA novel controlled molecular weight form of LARC-TPI polymide that exhibits an exceptionally high degree of melt flow in the 340-360 C temperature range has been developed. This material has been evaluated as a high-temperature adhesive, and because of its flow, cost-effective vacuum bag/oven processing can be used. Comparison of adhesive performance with higher molecular weight forms bonded at higher pressures shows this novel material to be equal in mechanical strength.
Document ID
19920027627
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Progar, Donald J. (NASA Langley Research Center Hampton, VA, United States)
St. Clair, Terry L. (NASA Langley Research Center Hampton, VA, United States)
Date Acquired
August 15, 2013
Publication Date
January 1, 1991
Subject Category
Mechanical Engineering
Meeting Information
Meeting: International SAMPE Symposium and Exhibition